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Visteon Announces Production of a Lead-Free Solder Electronic Module

19 December 2000

Visteon Announces Production of the Automotive Industry's First Lead-Free Solder Electronic Module

    DEARBORN, Mich., Dec. 18 Visteon Corporation
today announced the automotive industry's first use of lead-free solder paste
in a printed wiring board (PWB) electronic module.  Visteon received approval
from Ford Motor Company to manufacture and supply its Passive Anti-Theft
System (PATS) transceiver module using the lead-free solder.  The PATS
transceiver module is supplied by Visteon's Cockpit Strategic Business Unit
(SBU).
    The PATS module is a security device used to prevent a vehicle's ignition
from activating unless a unique access code is present that matches the
vehicle's engine control module.  The application of this environmentally
friendly technology demonstrates Visteon's commitment to protecting the
environment, as well as a high level of technological leadership.
    "This technology illustrates Visteon's environmental leadership efforts.
Additionally, it will enable us to meet future worldwide government
requirements, while meeting the needs of our customers," said Gary Mayo,
Director of Environmental Affairs for Visteon.  "We are pleased to provide
this first-ever lead-free PWB solder technology to Ford Motor Company."
    The lead-free solder PATS module uses a lead-free solder paste to replace
the tin-lead (Sn-Pb) alloy solder.  Visteon has been researching and
developing this technology for several years and it has exceeded performance
requirements in both laboratory analysis and in-vehicle testing.  The
implementation of this technology is a significant step forward in the
manufacturing and supply of lead-free electronics modules due to the
anticipated restrictions on the use of all but trace amounts of lead in most
or all vehicle components in North America, Europe, and Japan.