New Component Designs Will Drive Adhesive Demand in Electronics Engineered Materials, Advanced Device Packaging Will Spur Growth

27 November 2000

New Component Designs Will Drive Adhesive Demand in Electronics Engineered Materials, Advanced Device Packaging Will Spur Growth

    AMHERST, N.H.--Nov. 27, 2000--Continuing component miniaturization and the increased use of synthetic materials in electronic packaging are driving demand opportunities for specialty electronic adhesives.
    From new-generation polyphenylene sulfide resins to liquid crystal polymers, a growing spectrum of high-temperature materials are enabling electronics designers to shrink circuit board components down to micron dimensions while simultaneously increasing their functionality.
    Formerly considered a passive means to connect circuits to a substrate, deep sub-micron designs cause the device package to become an active part of the design, having significant impact on design performance. Engineers are turning increasingly to high performance synthetics to meet these packaging requirements. Because of their ability to join dissimilar materials, adhesives are being specified in the vast majority of these new designs. Despite high material costs, the growing list of engineered materials for electronic device packaging represents new opportunities for adhesives suppliers.
    To take advantage of the opportunities presented by these new technology and market developments, adhesive suppliers must be fully aware of the market potential for high performance electronic adhesives, as well as the design and product objectives of device designers. Suppliers must also be willing to act on this information by teaming with electronic device manufacturers to develop the assembly processes and pilot programs that will be required to bring these new applications to market.
    These findings are reported in a new, about-to-be-published market study. Specialty Electronic Adhesives: Markets and Opportunities has been researched and written to be of maximum value to adhesives suppliers. It consists of in-depth analyses, descriptions and evaluations of current and probable future market developments, technology issues and business factors - information necessary to compete effectively in this evolving market.

    For more information, please contact Edward Harris at (603) 673-0312, or fax (603-673-8313) or e-mail your request to info@tech-assessment.com. Visit us at www.tech-assessment.com.