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Philips Semiconductors Has New Angle on Automotive Sensing

16 October 2000

Philips Semiconductors Has New Angle on Automotive Sensing

 KMA200 Magneto-Resistive Angle Sensor Well Suited to X-by-Wire Applications

    DETROIT, Oct. 16 Philips Semiconductors, a division of
Royal Philips Electronics , today announced a programmable angular
measurement sensor for use in automotive applications. Listed as the KMA200,
the new device is accurate to within 0.6 of a degree. Due to its robust
design, accuracy and inherent safety, it is well suited to automotive
applications such as X-by-wire.
    The KMA200 is able to use the magneto-resistive (MR) properties of thin
film permalloy to sense the angle between an external magnetic field in the
plane of the sensor and the sensor itself. By using this technique, greater
accuracy can be obtained over far greater distances between the moving
surfaces than is possible with alternative devices, such as those based on the
Hall effect. The new device measures the angle directly, rather than by
derivative means, as in Hall effect products.
    Users of the device, which is delivered pre-calibrated, are able to
program adjustments to the angular range of the device and re-set its zero
point. They can also configure a 32bit identifier and set the device output to
an analog or digital form. The latter is delivered via a Motorola compatible
serial peripheral interface (SPI). Settings are stored in an EEPROM.
    When operating from a typical supply voltage of 5V the KMA200 consumes
50mW of power. Over voltage and reversed polarity protection are both
incorporated into the device, as is temperature supervision. Online diagnosis
features ensure that confidence is retained in the integrity of its output.
Input and output signals are constantly monitored and deviations and failures
of the angle value are indicated in the output signal. The controller and
memory are fully supervised. It is rated for operation at temperatures between
-40oC and +125oC.
    "The KMA200 is an important piece of the X-by-wire jigsaw," said Andreas
Ogrzewalla, International Product Manager at Philips Semiconductors. "It is a
significant step toward completing a picture that shows Philips Semiconductors
as a dominant global force in automotive electronics, able to deliver a
complete range of x-by-wire components to the industry. This component has
many applications within the car, is safer and more accurate than alternatives
and enables X-by-wire systems to be a reality."
    The KMA200 IC will be manufactured in a plastic multi-chip SOT637 five-pin
package, which measures approximately 20mm in length. It comprises two
components:  an MR sensor chip joined to a signal conditioning chip by six
interconnects. High volume production is planned from 2004, although first
production chips will be delivered to customers in 2002.

    About Philips Semiconductors
    Philips Semiconductors, which has annual revenues of approximately
US$5 billion, designs and manufactures semiconductors and silicon systems
platforms. Philips Semiconductors is spearheading the emerging field of
systems on silicon solutions with the innovative Nexperia(TM) platform and
VLSI Velocity(TM) tool set. The company's Sea-of-IP(TM) design methodology
allows plug and play intellectual property blocks for easily customizable
products. The company is a leader in communications, consumer, PC peripherals
and automotive semiconductors, which are key applications for convergence in
end-user products. Philips Semiconductors is headquartered in Eindhoven, The
Netherlands, and has operations throughout the world. For more information:
http://www.philips.semiconductors.com.