Viasystems Group, Inc. Reveals Cost Saving Backplane Packaging
8 August 2000
Viasystems Group, Inc. Reveals Cost Saving Backplane Packaging
RICHMOND, Va. - Viasystems Technologies Corp., LLC, a subsidiary of Viasystems Group, Inc. , a leading global provider of electronics manufacturing services today revealed their value-added cost saving clamshell packaging, designed to protect any size backplane from potential damage suffered during the rigors of shipping. Commonly known as "thermoforms," Viasystems' clamshell packaging has a minimum life span of five years and has provided Viasystems a zero return rate for their backplanes.Traditional methods for shipping include corrugated cartons designed with protective cushioning glued to the inside, foam-lined boxes to protect the backplane circuits, urethane foam blocks and anti-static bags. "All of that has been eliminated when using thermoform packaging," said Jim Ingersoll, quality manager, Viasystems. "Also eliminated are customer environmental concerns regarding disposal of the corrugated cartons and protective foam. Customers just ship the thermoforms back to Viasystems for reuse." Viasystems' clamshell packaging protects the product from damage, assuring the customer of a quality product.
The original expense of Viasystems' thermoform clamshell tray and lid design averages three times the cost of the traditional corrugated cartons. "Even so, protecting the circuitry on the backplane is crucial," said Tim Conlon, president, Viasystems Group, Inc. "Each clamshell pays for itself after three shipments. That's definitely value-added quality for our customers."
Headquartered in St. Louis, Mo., Viasystems Group, Inc. is a leading global electronics manufacturing services provider with over 20,000 employees and 29 manufacturing facilities in eight countries, supplying customers in the telecommunications, networking, automotive and consumer electronics industries. Viasystems is listed on the New York Stock Exchange, trading under the symbol "VG."