Algor's Heat Transfer Analyses Faster and Easier

22 May 2000

Flexibility of Multiple, Time-Varying Loads and New Elements Make Algor's Heat Transfer Analyses Faster and Easier

    PITTSBURGH--May 18, 2000--Algor, Inc., a leading maker of software for mechanical engineers, today announced new capabilities within its heat transfer product line, including the ability to input multiple load curves and a thermal rod element.
    The new features will reduce modeling and analysis times and provide engineers with an edge in time-to-market.
    Through the use of multiple load curves, engineers can now apply any type of nodal-, surface- or element-based load - temperature, convection, radiation, heat generation, heat flux - during transient heat transfer analyses to determine how parts or assemblies will react under such time-varying loads. The results of any heat transfer analysis can then be automatically applied as input for a linear static stress analysis or Mechanical Event Simulation.
    "By providing additional flexibility through the number and type of loads that engineers can include within their models, Algor's heat transfer product line allows engineers to simulate more complex thermal conditions," said Michael Bussler, president of Pittsburgh-based Algor. "This means the actual thermal event can be evaluated in a single FEA analysis and fewer analyses means faster time-to-market."
    Also new to Algor's heat transfer capabilities is a thermal rod element. The element -- drawn as a standard "line" element -- can be used to bridge the gap between unconnected parts. Rather than directly connecting multiple parts by matching different finite element meshes, rod elements can be used to connect the parts.
    These thermal rod elements then represent the characteristics of the void between the different parts in steady-state or transient heat transfer analyses. By varying the stiffness of the rod elements through data input, the engineer can define the connecting medium and vary the resulting heat flow.
    On the near horizon is another addition to Algor's heat transfer analysis capabilities: the thermal plate element. This element will provide the ability to define finite element models with plate/shell elements, which take less time to analyze than solid brick and tetrahedral elements. To automatically create thermal plate elements from a thin-walled CAD solid model, Algor offers midplane meshing, which converts thin, solid features into plate/shell elements using the midpoint of their thickness.
    The upgraded thermal capabilities work with Windows NT/95/98/2000. Algor customers with current technical support and maintenance agreements can request a complete software update, including the new thermal capabilities through Algor's Web site (www.algor.com) or an Algor account representative.