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Sheldahl Introduces Density Patch

6 March 2000

Sheldahl Introduces Density Patch(TM), a Low-Cost Alternative For Turning Low Density Circuits Into High Performance Assemblies
                    Designed for Specialized Applications
             Such as Automotive Instrumentation, ECUs & Consoles


    NORTHFIELD, Minn., March 6 Sheldahl, Inc.
this month introduces the Density Patch(TM), an innovative extension of its
flexible circuitry line that makes it possible to incorporate lower density
circuits into larger assemblies at minimal cost.  The new solution is designed
for specialized functions such as automotive instrumentation, electrical
control units, consoles and other applications requiring a small number of
electrical components to be deployed affordably and efficiently over a large
circuit.
    Assembled to order for each customer, the Density Patch is a small
high-density circuit populated on one of Sheldahl's Novaflex(R) flexible
circuit materials.  This small pre-tested assembly is then attached to a lower
density polyester substrate through a permanent lap solder connection,
allowing the patch to piggyback on a larger and less costly circuit.
    This eliminates the need to use large volumes of a more expensive material
capable of withstanding the heat of the solder process.  It also increases
manufacturing efficiencies by eliminating the need to place a small number of
components over a large area.  Depending on the specific requirements of the
application, customers should realize a cost saving of 10 to 25 percent.
    "With today's price pressures, manufacturers are seeking a solution
capable of turning a lower density circuit into a high performance assembly at
low cost," said Bruce Lindahl, Sheldahl's Product Manager for Standard Flex.
"By offering a way to permanently mate a small high-density circuit with a
less expensive larger circuit, our Density Patch provides engineers with
innovative options for producing cost-effective electronics."
    The new product leverages Sheldahl's expertise in flexible interconnects,
the breadth of its material offerings, and its ability to handle both assembly
and lap soldering in-house.  Customers can select from Sheldahl's Novaflex(R)
HD, VHD, Standard Flex and other Sheldahl substrates, depending on the
specifications required.
    Sheldahl is exhibiting the Density Patch in Booth 2673 at the 2000 SAE
International Congress and Exposition opening today Detroit.

    About Sheldahl, Inc.
    Sheldahl, Inc. is a leading producer of high-density substrates,
high-quality flexible printed circuitry, and flexible laminates primarily for
sale to the automotive electronics and data communications markets.  The
company, which is headquartered in Northfield, Minnesota, has operations in
Northfield; Longmont, Colorado; Detroit, Michigan; Britton, South Dakota;
Toronto, Ontario, Canada; and Chihuahua, Chihuahua, Mexico.  Its sales offices
are located in Hong Kong, China; Singapore; U.K.; France; and Germany.
Sheldahl's common stock trades on the Nasdaq National Market tier of the
Nasdaq Stock Market under the symbol:  SHEL.

    The discussion above contains statements within the meaning of the Private
Securities Litigation Reform Act of 1995.  These statements by their nature
involve substantial risks and uncertainties as described by Sheldahl's
periodic filings.  Actual results may differ materially depending on a variety
of factors, including but not limited to the following:  Sheldahl not entering
into an agreement with respect to a transaction; or any such transaction not
being consummated.  Additional information with respect to the risks and
uncertainties faced by Sheldahl may be found in, and the prior discussion is
qualified in its entirety by, the Risk Factors contained in the Company's
filings with the Securities and Exchange Commission, including Sheldahl's
Annual Report, Form 10-K for the fiscal year ended August 27, 1999, Forms 10-Q
for the quarters ended November 27, 1998; February 26, 1999 and May 28, 1999,
and other SEC filings.
    Sheldahl does not undertake any obligation to update any such factors or
to publicly announce developments or events relating to the matters described
herein.