Cinterion Wireless Modules Adds Automotive LGA Technology to its Market Leading M2M Portfolio

LAS VEGAS--Cinterion Wireless Modules, the global leader in cellular machine-to-machine (M2M) communication modules, today announced its new AGS3 automotive module at CTIA Wireless 2010. The new module strengthens Cinterion’s market-leading M2M product portfolio, adding land grid array (LGA) technology to its automotive grade modules.

“There’s tremendous opportunity and demand in the automotive sector and AGS3 with LGA mounting enables cost-effective, process manufacturing for eToll, eCall, fleet management and other large scale telematics applications.”

“We continue to push the M2M envelope, providing innovative modules for a broad range of budgets and applications worldwide,” said Norbert Muhrer, CEO and president, Cinterion Wireless Modules. “There’s tremendous opportunity and demand in the automotive sector and AGS3 with LGA mounting enables cost-effective, process manufacturing for eToll, eCall, fleet management and other large scale telematics applications.”

Optimized for Automotive Plus LGA Innovation

AGS3, Cinterion’s sixth generation automotive module, is optimized for peak performance and rugged automotive application environments. It includes solderable LGA surface mounting technology for efficient, fully automated manufacturing and process consistency as well as advanced telematics features and functionality.

AGS3 meets the requirements of the European eCall initiative and is ideal for ITS applications such toll collect, telematics, fleet management and emergency call and roadside assistance solutions. It provides GPRS class 12 data speeds on 2G Quad-Band frequencies (850/900/1800/1900 MHz) for worldwide coverage. Other highlights of AGS3 include:

Cinterion LGA 119 form factor mounting
Full TCP/IP support (TCP, UDP, HTTP, FTP, SMTP, POP3)
Industrial Interfaces (USB, 2x serial, SPI, I2C)
RLS monitoring / jamming detection
Advanced temperature management, operating range: -40°C to +85°C
Latest processor technology: ARM9, 65nm
Antenna diagnostics as manufacturing support
SIM access profile
Automotive e-mark certificate
Prepared for European e-call initiative

For more information about Cinterion’s new AGS3 module, please visit booth #341 in the M2M Zone at CTIA Wireless 2010 in Las Vegas, March 23-25.

About Cinterion Wireless Modules

Cinterion Wireless Modules is the worldwide leading supplier of cellular machine-to-machine (M2M) communication modules and combines unparalleled M2M engineering expertise and localized worldwide customer support with a strong portfolio of high-quality GSM, GPRS, EDGE, UMTS and HSPA products. Cinterion is a reliable partner and valued by many vertical market customers for its award-winning modules which enable machines, equipment and vehicles to communicate over wireless networks helping enterprises dramatically cut costs and increase productivity and efficiency. Cinterion products are carrier and FTA approved and used for industries including remote maintenance and control; metering; payment systems; routers and gateways; security systems; healthcare; automotive and eToll; tracking and tracing; environmental monitoring and more. The firm’s global headquarters are in Munich, Germany with sales and support offices in local markets around the world. For more information, please visit: www.cinterion.com.