XPEL Completes Private Placement Financing

SAN ANTONIO--XPEL Technologies Corp. (TSXV:DAP.U) announced today that it has received TSX Venture Exchange acceptance and has completed a non-brokered private placement totaling US$897,528; a total of 448,764 units were issued at a price of US$2.00 per unit. Each unit of the financing consisted of one common share, and one common share purchase warrant. Each warrant entitles the holder to purchase an additional common share of the Company for two years until September 7, 2009. A finder’s fee totaling US$31,850 was paid in connection with the private placement. The proceeds from the financing are intended to be used for acquisitions, working capital and capital investment. A minimum of a four-month trading hold will be applied to any securities issued pursuant to this offering.

XPEL Technologies Corp. is the worldwide leader in the electronic delivery of automotive aftermarket products, utilizing the Internet as an integral component for its design, manufacturing, distribution and customer relationship strategies. The Company's DAP software utility offers Dealers the industry’s most efficient and productive tool set to better serve customers with “best-in-class” solutions in real time. XPEL has clear advantages over the competition through its expansive proprietary library of installation-friendly paint and headlight protection and window tint products, coupled with a patented Internet-based remote manufacturing and distribution software, superior installation training curriculum and world-class facilities, with established and growing sales channels.

The TSX Venture Exchange has not reviewed and does not accept responsibility for the adequacy and accuracy of this information.

CUSIP: U98409102