Viasystems Announces Lead Free HASL Capability

ST. LOUIS--Viasystems, Inc., a global provider of printed circuit boards and electro-mechanical components and assemblies, announced today that it has added lead free HASL capability. The alloy utilized with this capability is SnCuNi (Nihon Superior SN100C) and the equipment contains both pre and post clean sections to insure the high quality of the products produced by Viasystems.

“We have added this capability in our manufacturing facility located in Zhongshan, China which we believe to be the largest producer of automotive products in China. This capability increases our RoHS compliant and lead free surface finishes for our customers. The addition of Lead Free HASL adds to our current RoHS compliant surface finishes which include Immersion Silver, Immersion Tin, Electroless Nickel/Immersion Gold, Deep Tank Gold and OSP,” stated Brian Barber, VP of Operations and Supply Chain Management for Viasystems.

This press release contains forward-looking statements as defined by the federal securities laws, and these statements are based upon Viasystems' current expectations and assumptions, which are inherently subject to various risks and uncertainties that could cause actual results to differ from those anticipated, projected, or implied. Certain factors that could cause actual results to differ include fluctuations in operating results and customer orders, a competitive environment, reliance on large customers, risks associated with international operations, ability to protect patents and trade secrets, environmental laws and regulations, relationship with unionized employees, risks associated with acquisitions, substantial indebtedness, control by large stockholders and other factors described in Viasystems' filings with the Securities and Exchange Commission.

Viasystems, Inc. is a global provider of complex multi-layer printed circuit boards and electro-mechanical components and assemblies. The company’s 18,600 employees serve more than 200 customers in the automotive, telecommunications, computer and data communications and industrial and instrumentation markets.