NxGEN Electronics Presents Erik Jones as Vice President of Memory Products; Experienced Technology Executive to Broaden Markets, Products and Services

SAN DIEGO--Sept. 22, 2006--NxGEN Electronics, a leader in advanced packaging services and products, welcomes Erik Jones as Vice President of Memory Products. Mr. Jones joins the NxGEN team to provide strategic leadership and expertise for the memory product division. Mr. Jones will lead NxGEN's memory product division with a focus on high-density, high-performance, memory devices, modules and subsystems.

"NxGEN Electronics is thrilled to welcome Erik to our executive management team," said Dick Brunsell, President of NxGEN. "We are at a pivotal place in our growth, and this addition represents a vital role for our company."

Erik Jones is a senior technology executive with extensive experience in memory product development. Coupled with his strong marketing and operations background, and a deep knowledge and experience in the OEM marketplace, Jones will be aggressively developing new markets for NxGEN.

Prior to joining NxGEN in 2006, Jones served as VP OEM Division for US Modular, where he was responsible for establishing product plans and marketing direction. Jones was also tasked with recruiting manufacturing and engineering management personnel and with managing strategic development programs.

Prior to his work with US Modular, Mr. Jones served as Director of Strategic Business Development at Southland Micro Systems, where he directed the corporate strategic planning process, developed the OEM business plan, and managed relationships with the company's largest OEM partners. At Southland, Jones was a key member of ISO9001:2000 steering committee.

About NxGEN Electronics

NxGEN Electronics, based in San Diego, California, is the leading provider of advanced electronic manufacturing services and products for the industrial, military, aerospace, medical, wireless, computer, and commercial markets. NxGEN specializes in high density, high performance 3D memory products; Systems-in-Package (SIP); Multi-Chip Modules (MCM); Sensors, MEMS, Flip Chip and Wafer Level Packaging; plus any other advanced applications where size, weight, power, and operational environments are critical. More information can be found on NxGEN's website, at www.NxGENelectronics.com or contact 858 309 6610, ext 3008.