MediaTek Expands Use of Teradyne's FLEX Platform for Next-Generation Test; Subcontractors Purchase Multiple FLEX Systems

BOSTON--June 2, 2005--Teradyne, Inc. announced MediaTek, one of the world's top fabless companies, has expanded its use of the FLEX(TM) platform at both final test and probe for new high-volume consumer devices. Teradyne(R) FLEX systems are testing next-generation storage devices used in consumer electronics. The selection of the FLEX platform by MediaTek has driven volume test system purchases by multiple Taiwan-based subcontractors over the past year.

"Fabless and subcon companies are selecting the FLEX platform for the outstanding cost of test improvements at both wafer probe and final test," said Risto Puhakka, President, VLSI Research. "The test, assembly and packaging subcontractor market grew by 38.4% to comprise a nearly $13 billion dollar industry in 2004. The test revenue portion of the subcontractor market has grown the fastest and now represents almost a third of total subcontractor revenue. FLEX is well designed to meet the test performance and economics of this market."

"MediaTek is a fabless leader in the optical storage drive and consumer device markets. More than 30% of FLEX systems to date have been sold into the subcon and fabless test market, with over three-quarters of those systems running production test," said George Rose, General Manager, Teradyne Semiconductor Test Broadband Business Unit. "The FLEX architecture is designed to deliver the most economical multi-site test solution for the sizable subcon test market."

About FLEX

Breaking the cost of test barrier with high-efficiency multi-site test while meeting the demands of increasing complexity for an expanding range of devices, FLEX advances multiple test technologies. FLEX spans test requirements from conventional DFT and structural test to standard analog and mixed-signal to complex SOC, for testing consumer, automotive, mass storage, wireless, and data communications devices. Its Tester-per-device-core(TM) architecture delivers a complete set of test resources to each device core, with instrument synchronization and control in device clock time on a vector-by-vector basis. The Universal Slot test head and high-density instrumentation allow easy reconfiguration to changing test needs, and the OpenFLEX(TM) open system architecture complements Teradyne's FLEX instrument suite, allowing the addition of focused instruments to further enhance system performance and test economics. To learn more about FLEX, visit http://www.teradyne.com/flex/.

About MediaTek

MediaTek Inc. is a leading provider of total solution for optical storage, digital consumer semiconductors and mobile phone chipset. Founded in 1997 and headquartered at Hsinchu Science Industrial Park, Taiwan, MediaTek is now one of the world's top 10 IC fabless companies and the world's largest chipset supplier of CD-ROM, DVD-ROM, CD-RW, Combi and DVD player. MediaTek's patent-pending, progressive scan algorithm, MDDi(TM) (Media Direct De-Interlacing) technology, delivers superior video quality to the end users. The MDDi technology utilizes an intelligent link between MPEG decoder and embedded progressive scan processor. It can reproduce the most accurate pictures from DVD movie discs. The Company's common stock is traded on the Taiwan Stock Exchange under the code "2454". For more information, please visit the Company's web site at www.mtk.com.tw.

About Teradyne

Teradyne is a leading supplier of Automatic Test Equipment and interconnection systems. The company's products deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. In 2004, Teradyne had sales of $1.8 billion, and currently employs about 5,900 people worldwide. For more information, visit www.teradyne.com. Teradyne(R) is a registered trademark of Teradyne, Inc. in the US and other countries. All product names are trademarks or registered trademarks of Teradyne, Inc. (including its subsidiaries) or their respective owners.