Another of Integral's 'ElectriPlast-PlasTenna' US Patent Applications Allowed

BELLINGHAM, Wash.--June 24, 2004--Integral Technologies, Inc. (OTCBB:ITKG) ("Integral"), announced today that an "addendum" patent application, to its recently granted US Patent 6,741,221 United States Patent Application titled "Low Cost Antennas Using Conductive Plastics or Conductive Composites", has been allowed by the United States Patent and Trademark Office. This addendum patent application incorporates additional claims into US Patent 6,741,221.

Commenting on the allowance of this US Patent Application, Integral's Thomas Aisenbrey, general manager and chief technology officer and inventor of the ElectriPlast-PlasTenna said, "The allowance of this addendum to the original patent application significantly broadens the claims, providing additional validation and security of the company's formulations for the ElectriPlast-PlasTenna technology."

The ElectriPlast-PlasTenna can revolutionize the way handheld devices such as cellular phones and PDAs are manufactured today, by the low costs and ease of molding the antenna as part of the device, or being the device's molded body itself. PlasTennas can also add covertness to numerous other antenna applications by concealing them to be handles, buttons, racks, mirror housings, moldings and or many other parts within vehicles, boats, aircraft etc., or even body worn antennas.

Currently, in the World of Plastics molding is defying all boundaries and exploding in growth. The increasing demand for conductive polymers is a big part of this growth. Integral's ElectriPlast, is a pelletized, proprietary, highly conductive recipe, specifically formulated for molding from a vast selection of base resins and polymers (Plastics & Rubbers). Thus, ElectriPlast can be molded into virtually any shape, size, or dimension associated with plastics, rubbers and other polymers. The differentiator being, ElectriPlast will conduct electricity as if it were a metal, as plastics are thought of usually as insulators. Virtually anything made from metals today can now be molded from ElectriPlast.

Two examples of the numerous applications of ElectriPlast are PlastiHeater, a thermal conductor that can radiantly heat floors and seats of vehicles etc., and PlastiCircuit, a moldable method of making electronic circuitry which is a lightweight alternative solution to that of conventional means of metal, wire or cable.

Integral Technologies, Inc. (www.itkg.net) has filed US provisional patents on an additional 65 plus uses for electronic applications and recipes around its ElectriPlast Technology.