Speedline Technologies to Showcase New Product Features at NEPCON Shanghai

FRANKLIN, Mass.--April 22, 2004--

Features Include: Electrovert(R) OmniExcel(R) 7 Reflow Oven MPM Gel-Flex(TM) Conformal Tooling System, MPM(R) Enhanced 2D with BridgeVision(TM) and MPM(R) Maxi-Miser(TM) Pump Technology

Speedline Technologies, Inc. will showcase a host of new product features for its electronics manufacturing equipment during NEPCON Shanghai 2004, April 26-29, in the Shanghai Everbright Convention & Exhibition Centre, West Hall, Level 1, Booth No. 1E02.

They include the MPM(R) Gel-Flex(TM) Conformal Board Support System, the new Flux Extraction System(TM) (a special feature of the new Electrovert(R) OmniExcel(R) 7 Reflow Oven), the MPM(R) Maxi-Miser(TM) Pump Technology, and the MPM(R) BridgeVision inspection.

-- Electrovert(R) OmniExcel(R) 7 Reflow Oven - sets new operating efficiency benchmarks by consuming up to 50% less power and up to 35% less nitrogen than conventional designs. This new seven-zone oven compliments the recently introduced OmniExcel(R) 10 zone oven to deliver a complete series of reflow systems for all production and processing needs. The new reflow oven incorporates a patent-pending, self-cleaning Flux Extraction System(TM) (FES) that dramatically reduces maintenance requirements.

-- MPM(R) Gel-Flex(TM) Tooling is an innovative and cost-effective answer to the challenge of supporting the circuit board during the stencil printing process. Consisting of non-conductive polyurethane elastomer gel enclosed within a durable membrane shell and mounted to a magnetic base, Gel-Flex(TM) tooling is a true conformal board-support system. The compressible gel material provides gentle compliance to delicate bottom-side components and leads while providing firm support for the entire board surface.

-- The MPM(R) Enhanced 2D with BridgeVision(TM) is a patent-pending method of analyzing acquired images using texture for assessment of paste deposits. Coupled with 2D verification on the AP Excel(TM) platform and AP HiE NT (as upgrades), this fast and efficient method of identification and analysis of potential bridging defects operates simultaneously with normal 2D paste inspection. The value to the customer is to efficiently prevent this #1 concern in the printing process from continuing downstream where value would be added to the subassembly.

-- MPM(R) Maxi-Miser(TM) Pump Technology - an innovative design that reduces materials costs, facilitates quick changeovers, and expands the range of usable materials. The pump represents a unique approach to paste management, featuring a smaller paste chamber that reduces material waste and compaction, and disposable inserts for simplified cleaning reducing maintenance downtime. The pump uses standard paste cartridges and MPM's patent pending, pressurized printing technology to deliver quality print results. It includes a disposable, quick-change blade system, and is compatible with MPM AP Excel(TM) platforms.

The product features (except Maxi-Miser) are available now from Speedline distributors and representatives. They will be among a host of systems to be showcased at NEPCON Shanghai 2004 at American Tecs's booth, Shanghai Everbright Convention & Exhibition Centre, West Hall, Level 1, Booth No. 1E02. For additional information, contact Speedline Technologies at 1-508-520-0083 or visit http://www.speedlinetech.com.

About Speedline Technologies

Speedline Technologies is the global leader for single-source process knowledge, solutions, and service to the PCB assembly and semiconductor packaging industries. Based in Franklin, Massachusetts, the company sells five, best-in-class brands - ACCEL microelectronics cleaning, CAMALOT dispensing systems, ELECTROVERT wave soldering, reflow soldering, and cleaning equipment, MPM stencil and screen printing systems, and PROTECT global services, support, and training solutions. For more information, visit us at www.speedlinetech.com.