Honeywell Announces Patent Agreement with DENSO

MORRIS TOWNSHIP, N.J.--April 5, 2004--

Honeywell Patent Covers Technology For Etching Silicon Wafers in the Manufacture of Pressure Sensing Integrated Circuits

Honeywell announced today it has reached an agreement with DENSO CORPORATION that allows DENSO CORPORATION and DENSO INTERNATIONAL AMERICA, INC. to use a Honeywell patent relating to the manufacture of pressure sensors used in automobiles. Financial terms were not disclosed.

The patented technology relates to an improved method of etching silicon wafers for the manufacture of pressure sensing integrated circuits.

"This agreement enables DENSO and Honeywell to benefit from years of pioneering research by Honeywell's Sensing and Control business on sensor technology used in a multitude of applications," said David Nathasingh, Honeywell Vice President of Licensing.

In accordance with the terms of the agreement, DENSO may use Honeywell's U.S. Patent No. 5,360,521 for the manufacture of certain of its pressure sensors.