The theme of this year's event is "True Partnership Amidst Changing Times," reinforcing ASE's commitment to position itself strategically as a long-term partner of its customers. ASE technology experts will deliver topics including ASE advanced technology developments and roadmaps, integrated flip chip packaging and wafer bumping technology, lead-free and green package updates, 300mm wafer bumping and RF testing solutions, and much more.
"The annual ASE Tech Forum serves as a platform for us to share views on the industry landscape and the latest developments in ASE technology in close proximity to our customers' locations," said Tien Wu, president, ASE Group, Americas, Europe and Japan. "Markets evolve and our customers continue to face new challenges on the performance and cost parameters. Of a stronger focus this year, is our efforts to maximize next generation chip solutions and minimize the burden on our customers' resource allocation through effective manufacturing. Hence, our theme for 2003's Tech Forum centers on partnerships."
"The annual ASE Tech Forum has been a significant technology trend indicator for the semiconductor backend manufacturing industry. Through dynamic interactions with the participants, we expect to set future roadmaps and blueprints for the industry's overall technology development efforts," said J.J. Lee, president, research and development, ASE Group. As the ASE Group technology guru, Lee will present a brief overview of the semiconductor market and the relevance of ASE technologies, roadmaps and product offerings.
To register for the ASE Tech Forum 2003 or to find more information about the event, please visit the event Web site at www.asetechforum.com or e-mail marketing@aseus.com.
About ASE Group
The ASE Group is one of the world's largest providers of semiconductor manufacturing services. As a global leader geared toward meeting the industry's ever-growing needs for faster, smaller and higher performance chips, the group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co. Ltd., a member of the ASE Group. The group generated sales revenues of $2.24 billion in 2002 and employs over 24,000 people worldwide. For more information about the ASE Group, visit www.aseglobal.com.