Palomar Technologies Introduces the Model 8000 High-Speed Wire Bonder; Large-Area Ball Bonder Offers Yielded Throughput in a Compact Package
VISTA, Calif.--July 16, 2003--Palomar Technologies announces the introduction of its Model 8000 high-speed thermosonic ball-and-stitch wire bonder. With a large, 12" x 6" (300 x 150mm) X-Y bond area, it can handle large hybrids, MCMs (multichip modules) or several smaller devices at one time. The bonder is capable of placing 8 wires per second with a table repeatability of better than +/-5 micron. A combination of the advanced Cognex 8000 vision system and dual-source programmable LED lighting also facilitates accurate targeting and placement. This level of positioning accuracy, along with highly repeatable ball formation, enables tight spacing between wires. Typical uses for the 8000 will be wire bonding for microelectronic packaging including most semiconductor-based interconnect applications."We threw out any pre-conceived notions and asked our customers and wire bonding process engineers what they considered to be an ideal wire bonder," said Jerry Jordan, product marketing manager at Palomar Technologies. "Many of the features of the 8000 bonder evolved from the needs of the industry."
Customers wanted a simple user interface and process control capability. The 8000's on-screen programming assistance allows "point-and-click" selection of bond placement sites. A true Windows(R) programming environment provides an operator with instant familiarity and easy navigation. The user interface features "cut and paste" programming along with drop-down menus, toolbars, and wizards that make this system easy to learn and use. Also offered on this platform are SPC software tools that allow the user to monitor and display critical process parameters.
The 8000's larger work area enables higher throughput. A typical high-speed ball bonder will offer only a 4 sq. in. (26 sq. cm) work area. The Model 8000 offers a full 72 sq. in. (450 sq. cm.) enabling more devices in the bond envelope and improving throughput by eliminating index time.
The bonder's compact footprint conserves precious cleanroom space. The SMEMA compatible, compact design, 1180 sq. in (0.76 m sq.), allows for an efficient cleanroom layout, whether the machine is a stand-alone solution or integrated into a full production line.
About Palomar Technologies
Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, has been an independent company since 1995. It is a leading supplier of automated high-precision assembly systems that increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace, medical, and life sciences industries. Processes include high accuracy component assembly with eutectic solder, epoxy, or laser attach, precision ball and wedge bonding, and active optical align and attach. Palomar's Process Development and Prototyping Services assists companies in developing or validating new products by providing design, engineering, prototyping, assembly, and automation expertise, as well as metrology resources to bridge the gap between product concept and automated production. For more information, visit www.palomartechnologies.com or contact 760-931-3600.
For more information, contact the Palomar office in your area:
Palomar Technologies, Inc. Tricia McGough 2230 Oak Ridge Way Vista, CA 92083 Phone: (760) 931-3440 Fax: (760) 931-3444 tmcgough@bonders.com Palomar Technologies Pte Ltd Wai Seng Chew 192 Pandan Loop #07-08/09 Singapore 128381 Phone: (65) 6779 2766 Fax: (65) 6779 7939 wschew@bonders.com Palomar Technologies GmbH Josef Schmidl Am Weichselgarten 30 b 91058 Erlangen, Germany Phone: 49-9131-48009-30 Fax: 49-9131-48009-55 jschmidl@bonders.com A-R Marketing, Inc. Andrea Roberts PO Box 501528 San Diego, CA 92150 Phone: (858) 451-8666 Fax: (858) 451-8777 aroberts@san.rr.com
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