DPAC Technologies to Present At AeA Micro Cap Financial Conference

    GARDEN GROVE, Calif.--May 6, 2003--DPAC Technologies Corp. , a technology company that designs and manufactures high-density memory and wireless products, will present at the AeA Micro Cap Financial Conference in Monterey, California on Tuesday, May 13, 2003.
    DPAC is scheduled to present at 8:30 a.m. Pacific Time. President and Chief Executive Officer, Ted Bruce will deliver the presentation. Breakout meetings will be held in private rooms for further discussion beginning at 1:15 - 4:45 pm. These meetings will give investors an opportunity to discuss DPAC further, personally meet the CEO and CFO, William Stowell, and ask any additional questions regarding the Company.

    About DPAC Technologies Corp.

    Based in Garden Grove, California, DPAC Technologies a provider of patented stacking technology for high-density, space saving surface mount electronic component and wireless products. DPAC's products are used in electronic circuits found in network servers, computer storage devices, guidance systems, medical instrumentation, communication devices and defense applications. The Company's web site is at www.DPACtech.com.