Ziptronix to Speak At Nanoventures 2002
RESEARCH TRIANGLE PARK, N.C.--March 4, 2002--Ziptronix today announced Bob Markunas, VP-Marketing, will speak and then participate in a panel discussion at the Texas Nanotechnology Initiative's (TNI) "NanoVentures 2002" Conference.
This year's conference, held March 7th-9th at the Renaissance Hotel in Richardson, TX, is titled "The Path to Commercialization of Nanotechnology". Unique in its focus and depth, NanoVentures 2002 consists of two full days of speakers and panels concentrating on the current state of nanotechnology and related opportunities for investment.
TNI and its co-hosts, Austin Ventures, STARTech Foundation, and Vortex Partners and conference partners Jackson Walker, L.L.P. and Zyvex Corporation will present sessions on Molecular Electronics, Materials, Optical/Wireless, NanoStorage, Biotech, and Fabrication and Assembly.
"The NanoVenture 2002 Conference is an important opportunity to showcase our technology," said Doug Milner, Ziptronix President and CEO. "Our breakthrough mixed material bonding and interconnect technology reduces cost and increases integration options which are critical in the nanotechnology space." Bob Markunas adds, "Nanotechnology offers potential benefits across many disciplines, however, reduction to practice has been difficult. Ziptronix offers a way to integrate new nanotechnology structures with mainstream integrated circuits enabling rapid product development and Time to Market."
Conference sessions begin on March 7th with a keynote speech from Steve Jurvetson, Managing Director of Draper Fisher Jurvetson. Other keynote speakers include: Harold R. "Skip" Garner, Jr., Professor, UT Southwestern Medical Center; James M. Tour, Rice University; Ken Cox, NASA; Ray Kurzweill, 1999 National Medal of Technology; Mihail Roco, Senior Advisor at the National Science Foundation; and William L. Warren, President of Sciperio. For more information visit the NanoVentures 2002 web site at www.nanoventures.ws.
About Ziptronix
Ziptronix is a semiconductor integration company founded on the simple but powerful premise that 3-D integration of semiconductors provides the most cost efficient means of simultaneously improving a circuit's power consumption, speed and form factor. The Company delivers a unique non-adhesive, room temperature wafer-to-wafer or die-to-wafer bonding and interconnect technology that, for the first time, allows for cost effective creation of true 3-D circuits.