Taiyo Yuden Develops Integrated Bluetooth v1.1 Full Module for Next-Generation Automotive Applications
SCHAUMBURG, Ill.--Dec. 10, 2001--Taiyo Yuden Co. Ltd., a forerunner in Bluetooth(TM) module development and manufacturing, announces the development of a fully integrated Bluetooth v1.1-compliant Full Module for next-generation automotive applications, including sound systems, navigational/telematics devices and Bluetooth-based hands-free kits.
Incorporating chipsets from its technology partner, Texas Instruments, the robust new Taiyo Yuden Bluetooth Automotive Module is a Class 2 Device (max 4dBm output) designed for harsh automotive industry temperature specifications of -30 to +85C.
Additional Taiyo Yuden Automotive Full Module highlights:
| -- | The expanded onboard flash memory (2MB) improves the robustness of the module and makes it suitable for higher-level applications by allowing the protocol stacks normally reliant on the host CPU to now be handled by the processor embedded on the module. |
| -- | Module size is only 28.0mm (1.10") L x 19.5mm (0.77") W x 2.9mm (0.11") H. |
| -- | Production samples will be available in February 2002, with volume production beginning in June. (Taiyo Yuden forecasts production of its entire Bluetooth module line will achieve one million units per month in 2002.) |
Price & Delivery: Consult Factory
About Taiyo Yuden:
Taiyo Yuden, a rapidly emerging leader in Bluetooth module development and implementation, combines its expertise in multilayered component manufacturing, high-frequency circuitry design, advanced assembly techniques and evaluation technologies with aggressive Bluetooth research, development and strategic partnerships. Now in its fifty-first year, Tokyo-based Taiyo Yuden Co. Ltd. is a worldwide manufacturer of surface mount and leaded passive components, power electronics modules and power supplies. With approximately 50 percent of the worldwide market in high-frequency multilayer chip inductors used in cellular phone applications, Taiyo Yuden reports annual sales of nearly U.S. $1.6B. Worldwide, Taiyo Yuden employs more than 18,000 people, and the company's North American affiliate, Taiyo Yuden (U.S.A.) Inc., operates sales and engineering offices in Chicago, San Jose, Calif., and San Diego County. See www.t-yuden.com.
About Texas Instruments:
Founded in Dallas in 1930, Texas Instruments is a world leader in digital signal processing (DSP) and analog semiconductor technology. Possessing the world's most advanced integrated circuits engineering and development capability, Texas Instruments also enjoys the largest share of GSM baseband chipset sales in the world.
Technology Background:
Founded in May 1998 by Ericsson, Nokia, Intel, IBM and Toshiba, the Bluetooth Special Interest Group (SIG) is the official Bluetooth Specification standardization committee. 2100 companies participate in the organization today, with Microsoft, 3Com, Lucent and Motorola the current promoting members. Bluetooth Specification Version 1.1 was released in May 2001 as an update to the 1.0 specification of July 1999. Bluetooth modules are classified by output: Class 1 (max 20dBm), Class 2 (max 4dBm) or Class 3 (0dBm). The higher the output, the more distance the device can cover. Flip-chip assembly mounts the chip directly on the PCB using terminations called "bumps." After mounting, insulation materials are inserted between the chip and board. The big advantage that flip-chip enjoys over conventional wire-bonding methods is that it requires significantly less mounting space.
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