Siemens VDO Selects 32-Bit Microcontrollers for Powertrain Systems

    MUNICH, Germany--Aug. 14, 2001--Infineon Technologies (DAX:IFX) today announced that it will supply Siemens VDO Automotive with 32-Bit microcontrollers for use in high-performance automotive powertrain systems. Infineon's AUDO family of 32-Bit microcontrollers, the TC1775 and TC1765, will be used in advanced engine management and transmission management powertrain systems, which comply with European and American emission standards and enable advanced performance requirements of future automobiles.
    The AUDO family is based on Infineon's TriCore(TM) Unified Processor architecture and has been designed specifically to meet the demanding reliability, temperature and operating requirements of advanced automobiles. The TC1775, which is the first AUDO family chip product in production, was developed for use in high-end engine management systems, while the TC1765 is designed specifically for mid-range engine and transmission control systems.
    Siemens VDO Automotive's selection strengthens Infineon's position as a leading supplier of ICs and system solutions for automotive applications. According to the market research company Strategy Analytics, Infineon is Europe's number one semiconductor manufacturer for automotive applications, with an overall sales market share of 13.6 percent in the year 2000.
    "We chose Infineon because of the company's strong commitment to the automotive market, our experience using the company's C167 products for powertrain devices, and the distinctive features and performance of the company's 32-bit TriCore architecture," said Jean-Marc Andre, Vice president & General Manager Powertrain Electronics for Siemens VDO Automotive. "The AUDO family is a very attractive platform for our future requirements in Powertrain Electronics at optimized costs and will be one of the key components of our digital core strategy."
    "Siemens VDO Automotive is a world leading automotive system supplier and we are pleased with their selection of our TriCore-based microcontrollers for the development of powertrain systems," said Gregor Maethner, Key Account Manager for Siemens VDO Automotive at Infineon Technologies. "We look forward to continuing our strong working relationship and contributing to the ability of Siemens VDO to develop systems that meet and exceed the industry's requirements for performance and integration."

    Technical Details on TC1775 and TC1765

    Both products of the AUDO family are based on Infineon's TriCore Unified Processor architecture, introduced in 1998. This architecture is ideal for high performance realtime applications. It is designed to seamlessly execute both microcontroller and digital signal processing tasks, thus providing distinct performance advantages in embedded system applications. The integrated DSP functionality that is a unique benefit of the AUDO family, compared to alternative 32-Bit solutions, enables capabilities such as the implementation of an electrical knock recognition without a separate standalone DSP or a special ASIC.
    The TC1775 includes a full set of peripherals for powertrain applications. Compared to other microcontrollers used in this application, it includes a second 32-bit RISC core, the integrated Peripheral Control Processor (PCP), to further increase the system performance. The PCP allows for example the OSEK-compliant separation of the software in "Physical Layer" and "Application Layer" (OSEK = open system and interface for use in automobiles). The PCP functionality within the TC1765 is performed by a 2 x 4 channel Direct Memory Access (DMA) controller. Compared to other 32-Bit controllers both devices provide a high-end system performance and a higher code density, as the TriCore architecture supports both 16-Bit and 32-Bit instructions.

    Availability and Packaging

    The TC1775 will be available for volume production in a 329-Pin Plastic Ball Grid Array (P-BGA) package starting Q1 2002. The TC1765 is planned for volume production end of Q4 2002 in a 260-Pin Low-Profile Ball Grid Array (L-BGA) package.
    More information on the TriCore architecture at www.infineon.com/tricore.