Thermally Conductive Adhesives Set for Rapid Growth; Processor Speeds, Shrinking Geometries Driving Demand

    AMHERST, N.H.--April 3, 2001--The speed and power of new electronic designs are presenting unique challenges to electronic engineers. In the PC industry, shrinking chip designs, escalating main processor speeds and the proliferation of graphics processors are increasing thermal loading to the point where heat transfer has become an overriding design constraint.
    Designers are turning to thermally conductive adhesives to cope with the challenges presented by these new devices. New formulations of conductive adhesives, able to withstand mechanical stresses with little degradation in performance, are recording design wins in a wide range of applications.
    Unlike mechanical heat dissipation alternatives such as extruded aluminum which depend on surface area to be effective, and present an obstacle to streamlined unit packaging, thermally conductive adhesives eliminate the need for mechanical fasteners and clips, while providing efficient thermal transfer between transistors or microprocessors and their heat sinks. Opportunities exist for thermally conductive adhesives in electronic device fabrication, substrate assembly, and product packaging.
    These opportunities are detailed in a new publication from Technology Assessment Associates. Thermally Conductive Adhesives: Markets and Opportunities has been researched and written to be of maximum value to adhesives suppliers. It consists of in-depth analyses, descriptions and evaluations of current and probable future market developments, technology issues and business factors - information necessary to compete effectively in this evolving market.
    For more information, visit us at www.tech-assessment.com.