Si2 Announces New Power Distribution Network Standard for 3D Integrated Circuits

The Silicon Integration Initiative (Si2)

AUSTIN, Texas--May 30, 2013: The Silicon Integration Initiative (Si2) announced the release of a Power Distribution Network Standard for 3D Integrated Circuits under the auspices of the Open3D Technical Advisory Board (TAB). The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows. This standard has been enabled by a contribution from Apache, a fully owned subsidiary of ANSYS Corporation.

“2.5D and 3D integration have been identified as the means to stretch semiconductor technology into the "More than Moore”

The 3D-IC Design Exchange Format Standard for Power Distribution Networks (PDN) describes a unified interface protocol for both Power/Ground and signal ports for die-2-die, die-2-package and package-2-PCB interfaces. This also allows the creation of compact SPICE-level descriptions to aid in the design, analysis and optimization of the resulting networks that define these interfaces to ensure they meet the requirements for power and signal integrity. The standard is available for download at: Page 1657 .

"The PDN standard effort began with 11 industry members and an initial spec contribution from Apache," said Norman Chang, Vice President and Senior Product Strategist at Apache Design, a subsidiary of ANSYS. "So it is rewarding to now see the first Si2 Open3D PDN standard become a reality in assisting power/signal integrity checking for 3D-IC design with dies from multiple technologies and vendors."

"2.5D and 3D integration have been identified as the means to stretch semiconductor technology into the "More than Moore" regime," says Sumit DasGupta, Sr. Vice President, Engineering, Si2. "Open standards to enable best-in-class design flows and tools are essential to ensure that this nascent technology delivers on its promise."

Additional working groups for Open3D TAB members include developing standards to support:

  • Thermal design and analysis of an entire 3D stack, including thermal constraints between neighboring dies
  • Expression of design constraints into and out of the path-finding and floorplanning stage of the overall design process

At the upcoming Design Automation Conference in Austin, Si2 will be presenting several sessions on the new Power Distribution Network, as well as other activities of the Open3DTAB group, and other Si2 standards efforts. A complete schedule of the presentations to be held in the Si2 Booth #1427 can be found at: Page 1651 .

For more information on the Open3D TAB, click here: Page 1380 .

Membership in Si2 projects is open to all interested parties across the semiconductor supply chain. For more information see: Page 1137 .

Open3D TAB Members:

Altera , AMD , ANSYS , Atrenta, Cadence Design Systems , Fraunhofer Institute, GLOBALFOUNDRIES, Helic S.A., IBM , Intel , Invarian, Mentor Graphics , Qualcomm , R3Logic, SEMATECH, STMicroelectronics , and Texas Instruments .

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured. Now in its 25th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 80 companies involved in all parts of the silicon supply chain throughout the world.

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